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About American Dicing

Located in Liverpool, New York, in the heart of the Semiconductor Superhighway, American Dicing is a longstanding source for wafer processing, die-sorting, and wire bonding.   Our goal is to make the thoughts and plans of engineers and researchers become a reality.  

 

Founded in 1993 by Richard Carta, a seasoned professional with over 15 years of experience in the semiconductor industry, American Dicing was created to meet the growing demand for dicing and packaging services.

 

Over the years, the company has expanded to become an industry-known provider working in many fields, including, but not limited to:

The Military

Aerospace

Medical 

RFID Communications

Renewable Energy

We work with the students and faculty of many Scientific Universities to help their concepts become realities.

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