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Precision Wafer Dicing + Scribing Services
Packaging Services Include:
Die Mounting, Bonding + Wire Bonding
Die Sorting to Tape + Reel, Waffle Packs, Trays, or Hoops
American Dicing, Inc.
Wafer Dicing, Die Sorting & Packaging Services
Servicing microelectronic and miniature fabrication industries in the USA
Incorporated in 1993, American Dicing Inc. has experience in high precision dicing and scribing since 1987. We offer a broad range of services from prototypes to production volumes and the capability to work with wafers up to 12” in size.
We Provide an ESD Safe Environment at American Dicing
Air Ionizers
Employee wrist straps, heel straps, & ESD safe smocks
Conductive Flooring
Air Ionizers
Internal
Auditing
+ ESD
Training
Grounded workstations with constant monitors
Your Product is Safe with Us!
State-of-the-art facilities:
Production is done in a Class 10,000 Clean Room environment with Class 1,000 works stations.
Our staff is trained to handle your devices with care and precision.
Industries Served
Military • Aerospace • Medical
RFID Communications • Scientific Universities
Research Labs • Commercial Electronics
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