Your browser doesn't support JavaScript or you have disabled JavaScript.

1.315.428.1200

Wafer Dicing, Die Sorting and Packaging Services.

PACKAGING Services

We offer precision Wire Bonding and Die Bonding services.
stacks_image_0A49B87E-29F7-408F-A21A-117372B58B93
stacks_image_428645F3-D81F-4EE1-8B18-D4048951A784
  • Die Mount
  • Goldball Bond or Wedge Bond
  • Goldball bonding (0.0007" to 0.0015" wire)
  • Glob top or epoxy seal
  • Die Sizes From .008" and up
  • Wire pull and ball shear test
  • Die placement accuracy within +/- .001" on all die