1.315.428.1200

Wafer Dicing, Die Sorting and Packaging Services.

PACKAGING Services

We offer precision Wire Bonding and Die Bonding services.

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Die Mount
Goldball Bond or Wedge Bond
Goldball bonding (0.0007" to 0.0015" wire)
Glob top or epoxy seal
Die Sizes From .008" and up
Wire pull and ball shear test
Die placement accuracy within +/- .001" on all die