DIE SORTING Services
Our fully Automatic Die Sorters include wafer mapping and vision inspection before picking and place into a variety of outputs.
Our fully Automatic Die Sorters include wafer mapping and vision inspection before picking and place into a variety of outputs.
Die Sorting
• Die sort into waffle packs, Tape & Reel,
Gel-paks, Jedec trays or film-frame
• Die sizes from .008" and up
• Up to 8" wafer diameter capability
• Ink dot or wafer map input
• Flip Chip capability for bumped devices
• Die sorting from wafers to new wafers with
known good die
• Manual pick and place for pressure sensitive parts
• Vacuum seal dry packaging
• Customized labeling
Gel-paks, Jedec trays or film-frame
• Die sizes from .008" and up
• Up to 8" wafer diameter capability
• Ink dot or wafer map input
• Flip Chip capability for bumped devices
• Die sorting from wafers to new wafers with
known good die
• Manual pick and place for pressure sensitive parts
• Vacuum seal dry packaging
• Customized labeling
Inspection
• Commercial visual inspection
(100% or as required)
• Wafer inspection on August NSX-90
• Capable of inspecting full wafers as well as
sawn wafers on dicing frames
• Inspect capability 1um
• Improved process control
• Higher throughput
• Higher quality product through inspection consistency
• Instance On-line data feedback
• Wafer map importing and exporting
• Provide Ink Dot for rejected die
(100% or as required)
• Wafer inspection on August NSX-90
• Capable of inspecting full wafers as well as
sawn wafers on dicing frames
• Inspect capability 1um
• Improved process control
• Higher throughput
• Higher quality product through inspection consistency
• Instance On-line data feedback
• Wafer map importing and exporting
• Provide Ink Dot for rejected die