DICING Services
Our saws are fully programmable to efficiently handle small and large quantities of wafers and substrates.
Our saws are fully programmable to efficiently handle small and large quantities of wafers and substrates.
- Fully Automatic saws for high production runs
- Surfactants and CO2 bubbler available
- Small or large quantities for all materials
- Custom dicing (slotting, multidepth, Bevel and angle cutting)
- Wafer sizes from .25" to 12"(300mm) diameter
- Substrates from .002" up to .6" thick
- Handle wafers on Film Frames or hoops, 100% saw through (Or as specified)
- Experience in image sensor dicing, RFID, Solar panels, Bonded wafers (Si on Glass) MEMS devices
- Non-standard mask layouts (For handling many different size die on one substrate)